Effect of sputtering target power on microstructure and mechanical properties of nanocomposite nc-TiN/a-SiNx thin films

Zhang, Sam, Sun, Deen, Fu, Yong Qing and Du, Hejun (2004) Effect of sputtering target power on microstructure and mechanical properties of nanocomposite nc-TiN/a-SiNx thin films. Thin Solid Films, 447-8. pp. 462-467. ISSN 0040 6090

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Official URL: http://dx.doi.org/10.1016/S0040-6090(03)01125-8

Abstract

Nanocrystalline TiN has been imbedded in amorphous silicon nitride matrix to form a super hard nanocomposite thin film (nc-TiN/a-SiNx) via magnetron sputtering. Adjusting Ti and Si3N4 target power ratio altered film composition, size, amount and distribution of the nc-TiN phase. At a Ti target power density of 5.5 W cm−2, the Ti to Si3N4 target power ratio should be greater than unity in order for nc-TiN to form, otherwise, Ti will dissolve in amorphous SiNx. The relationship between the film hardness and the crystallite size show Hall–Petch and anti-Hall–Petch relationship. A ‘scratch crack propagation resistance’ parameter, or CPRs=Lc1(Lc2−Lc1), has been proposed to approximate thin film toughness from the critical load data easily obtained from a scratch adhesion test.

Item Type: Article
Uncontrolled Keywords: Nanocomposite; Ti–Si–N film; Microstructure; Hardness; Toughness
Subjects: F200 Materials Science
Department: Faculties > Engineering and Environment > Physics and Electrical Engineering
Depositing User: Becky Skoyles
Date Deposited: 26 Mar 2015 15:16
Last Modified: 10 Aug 2015 11:37
URI: http://nrl.northumbria.ac.uk/id/eprint/21831

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