Evolution of surface morphology in TiNiCu shape memory thin films

Fu, Yong Qing, Sanjabi, Sohrab, Barber, Zoe, Clyne, Bill, Huang, Wei Min, Cai, M., Luo, Jikui, Flewitt, Andrew and Milne, William (2006) Evolution of surface morphology in TiNiCu shape memory thin films. Applied Physics Letters, 89 (17). p. 171922. ISSN 0003 6951

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Official URL: http://dx.doi.org/10.1063/1.2361275

Abstract

A transition of filmsurface morphology between wrinkling and surface relief during heating/cooling is reported for a sputtered TiNiCu thin filmshape memoryalloy. The mechanisms for this transition are discussed based on film stress evolution. During annealingsurface wrinkling occurs to relieve compressive stress in the film, while the surface relief morphology occurs during cooling due to the martensitic transformation, which relieves tensile stress.

Item Type: Article
Subjects: F200 Materials Science
Department: Faculties > Engineering and Environment > Physics and Electrical Engineering
Depositing User: Becky Skoyles
Date Deposited: 27 Mar 2015 09:37
Last Modified: 07 Mar 2016 14:28
URI: http://nrl.northumbria.ac.uk/id/eprint/21872

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