Localised laser joining of glass to silicon with BCB intermediate layer

Wu, Qiang, Kloss, S., Lorenz, Norbert, Moore, A. and Hand, Duncan (2008) Localised laser joining of glass to silicon with BCB intermediate layer. In: 3rd Pacific International Conference on Application of Lasers and Optics (PICALO 2008), 16-18 April 2008, Beijing.

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Abstract

Localised laser heating is an ideal solution to the problem of packaging micro-electro-mechanical-systems (MEMS) whilst maintaining a low device temperature to avoid changes in temperature-sensitive materials. In this paper we present localised laser bonding of glass to silicon by using a fibre-delivered high power laser diode array to cure an intermediate layer of the thermosetting polymer Benzocyclobutene (BCB). In our experiments, we use two ways to realize localised heating: one is by using scanning focused laser beam; the other is to use an axicon lens and followed a conventional lens to generate a focused ring. FE simulation indicates that provided sufficient heat sinking is provided at the rear of the device, both techniques result in very little in-process heating in the centre of the package, and this is confirmed by the use of a temperature-sensitive paint.

Item Type: Conference or Workshop Item (Paper)
Subjects: F200 Materials Science
H600 Electronic and Electrical Engineering
Department: Faculties > Engineering and Environment > Physics and Electrical Engineering
Related URLs:
Depositing User: Ay Okpokam
Date Deposited: 19 Jun 2015 13:18
Last Modified: 10 Aug 2015 11:32
URI: http://nrl.northumbria.ac.uk/id/eprint/23015

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