Items where Author is "Dai, Siyang"

Article

Dai, Siyang, Wang, Zhiqiang, Wu, Haimeng, Song, Xueguan, Li, Guofeng and Pickert, Volker (2021) Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 200-211. ISSN 2156-3950

Book Section

Gu, Bowen, Wu, Haimeng, Pickert, Volker, Ji, Bing, Dai, Siyang and Wang, Zhiqiang (2022) Deformation analysis of Press-pack IGBT using thermal mechanical coupling method. In: Conference Proceedings of 2021 International Joint Conference on Energy, Electrical and Power Engineering: Power Electronics, Energy Storage and System Control in Energy and Electrical Power Systems. Lecture Notes in Electrical Engineering, 899 . Springer, Singapore, pp. 23-33. ISBN 9789811919213, 9789811919220

Gu, Bowen, Wu, Haimeng, Pickert, Volker, Dai, Siyang, Wang, Zhiqian, Li, Guofeng, Ding, Shuai and Ji, Bing (2021) Condition monitoring of press-pack IGBT devices using Deformation Detection Approach. In: The 10th International Conference on Power Electronics, Machines and Drives (PEMD 2020). IET, Stevenage, pp. 355-360. ISBN 9781839535420