Items where Author is "Pok, Y.W."
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Pok, Y.W., Sujan, D., Rahman, Muhammad and Dol, S.S. (2017) Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging. In: 3rd International Conference on Mechatronics and Mechanical Engineering (ICMME 2016). MATEC Web of Conferences Volume 95 (2017), 95 . EDP Sciences, Paris, 01003. ISBN 9781510836921
