Improving diamond–metal adhesion with graded TiCN interlayers

Sun, Chang Qing, Fu, Yong Qing, Yan, Bibo, Hsieh, Jang-Hsing, Lau, S. P., Sun, Xiaowei and Tay, Beng Kang (2002) Improving diamond–metal adhesion with graded TiCN interlayers. Journal of Applied Physics, 91 (4). p. 2051. ISSN 0021 8979

Full text not available from this repository. (Request a copy)

Abstract

An approach improving diamond–metal adhesion has been developed based on modeling predictions and experimental verifications on the interfacial stresses modified by catalytic reaction. It is found that N-plasma irradiating onto Ti and tungsten-carbide substrates generates tensile surface stresses while C-plasma irradiation creates strongly compressive stress at the surfaces, both of which deteriorate the diamond–metal adhesion. It is also found that surface oxidation prevents diamondnucleation. Therefore, we applied a graded TiCN interlayer with carefully adjusting the ratio of C and N in the gas mixture to neutralize the interfacial stress and, hence, we have improved the diamond–metal adhesion substantially.

Item Type:	Article
Subjects:	F200 Materials Science
Department:	Faculties > Engineering and Environment > Mathematics, Physics and Electrical Engineering
Depositing User:	Becky Skoyles
Date Deposited:	25 Mar 2015 16:00
Last Modified:	12 Oct 2019 19:05
URI:	http://nrl.northumbria.ac.uk/id/eprint/21783

Downloads