Improving diamond–metal adhesion with graded TiCN interlayers

Sun, Chang Qing, Fu, Yong Qing, Yan, Bibo, Hsieh, Jang-Hsing, Lau, S. P., Sun, Xiaowei and Tay, Beng Kang (2002) Improving diamond–metal adhesion with graded TiCN interlayers. Journal of Applied Physics, 91 (4). p. 2051. ISSN 0021 8979

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An approach improving diamond–metal adhesion has been developed based on modeling predictions and experimental verifications on the interfacial stresses modified by catalytic reaction. It is found that N-plasma irradiating onto Ti and tungsten-carbide substrates generates tensile surface stresses while C-plasma irradiation creates strongly compressive stress at the surfaces, both of which deteriorate the diamond–metal adhesion. It is also found that surface oxidation prevents diamondnucleation. Therefore, we applied a graded TiCN interlayer with carefully adjusting the ratio of C and N in the gas mixture to neutralize the interfacial stress and, hence, we have improved the diamond–metal adhesion substantially.

Item Type: Article
Subjects: F200 Materials Science
Department: Faculties > Engineering and Environment > Mathematics, Physics and Electrical Engineering
Depositing User: Becky Skoyles
Date Deposited: 25 Mar 2015 16:00
Last Modified: 12 Oct 2019 19:05

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