Sputtering deposited TiNi films: relationship among processing, stress evolution and phase transformation behaviors

Fu, Yong Qing, Du, Hejun and Zhang, Sam (2003) Sputtering deposited TiNi films: relationship among processing, stress evolution and phase transformation behaviors. Surface and Coatings Technology, 167 (2-3). pp. 120-128. ISSN 0257 8972

Full text not available from this repository. (Request a copy)

Abstract

TiNi films were prepared by co-sputtering a Ti50Ni50 target and a Ti target under different process parameters. Stress in TiNi film on silicon substrate were evaluated using curvature method. A wide range of residual stress levels (either tensile or compressive) were found in the deposited films, depending significantly on Ti/Ni ratio, gas pressure, deposition temperature and/or annealing conditions. Stress evolution for as-deposited amorphous films during annealing process were systematically studied with the consideration of residual stress in as-deposited films; thermal stress; tensile stress due to densification crystallization; stress relaxation due to martensite transformation, etc. Upon heating, the crystallized TiNi films generated large tensile stresses when transforming from martensite to austenite, whereas during cooling, the stress relaxed significantly when austenite transformed back to the ductile martensite. The stress generation and relaxation behavior was significantly affected by film composition, deposition temperature and/or annealing temperature.

Item Type:	Article
Uncontrolled Keywords:	Sputtering; TiNi thin film; Shape memory; Martensite transformation; Stress; Curvature method; Annealing
Subjects:	F200 Materials Science
Department:	Faculties > Engineering and Environment > Mathematics, Physics and Electrical Engineering
Depositing User:	Becky Skoyles
Date Deposited:	26 Mar 2015 13:00
Last Modified:	12 Oct 2019 19:05
URI:	http://nrl.northumbria.ac.uk/id/eprint/21820

Downloads