Effect of sputtering target power on microstructure and mechanical properties of nanocomposite nc-TiN/a-SiNx thin films

Zhang, Sam, Sun, Deen, Fu, Yong Qing and Du, Hejun (2004) Effect of sputtering target power on microstructure and mechanical properties of nanocomposite nc-TiN/a-SiNx thin films. Thin Solid Films, 447-8. pp. 462-467. ISSN 0040 6090

Full text not available from this repository. (Request a copy)

Abstract

Nanocrystalline TiN has been imbedded in amorphous silicon nitride matrix to form a super hard nanocomposite thin film (nc-TiN/a-SiNx) via magnetron sputtering. Adjusting Ti and Si3N4 target power ratio altered film composition, size, amount and distribution of the nc-TiN phase. At a Ti target power density of 5.5 W cm−2, the Ti to Si3N4 target power ratio should be greater than unity in order for nc-TiN to form, otherwise, Ti will dissolve in amorphous SiNx. The relationship between the film hardness and the crystallite size show Hall–Petch and anti-Hall–Petch relationship. A ‘scratch crack propagation resistance’ parameter, or CPRs=Lc1(Lc2−Lc1), has been proposed to approximate thin film toughness from the critical load data easily obtained from a scratch adhesion test.

Item Type:	Article
Uncontrolled Keywords:	Nanocomposite; Ti–Si–N film; Microstructure; Hardness; Toughness
Subjects:	F200 Materials Science
Department:	Faculties > Engineering and Environment > Mathematics, Physics and Electrical Engineering
Depositing User:	Becky Skoyles
Date Deposited:	26 Mar 2015 15:16
Last Modified:	12 Oct 2019 19:05
URI:	http://nrl.northumbria.ac.uk/id/eprint/21831

Downloads