Wu, Qiang, Kloss, S., Lorenz, Norbert, Moore, A. and Hand, Duncan (2008) Localised laser joining of glass to silicon with BCB intermediate layer. In: 3rd Pacific International Conference on Application of Lasers and Optics (PICALO 2008), 16-18 April 2008, Beijing.
Full text not available from this repository. (Request a copy)Abstract
Localised laser heating is an ideal solution to the problem of packaging micro-electro-mechanical-systems (MEMS) whilst maintaining a low device temperature to avoid changes in temperature-sensitive materials. In this paper we present localised laser bonding of glass to silicon by using a fibre-delivered high power laser diode array to cure an intermediate layer of the thermosetting polymer Benzocyclobutene (BCB). In our experiments, we use two ways to realize localised heating: one is by using scanning focused laser beam; the other is to use an axicon lens and followed a conventional lens to generate a focused ring. FE simulation indicates that provided sufficient heat sinking is provided at the rear of the device, both techniques result in very little in-process heating in the centre of the package, and this is confirmed by the use of a temperature-sensitive paint.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | F200 Materials Science H600 Electronic and Electrical Engineering |
| Department: | Faculties > Engineering and Environment > Mathematics, Physics and Electrical Engineering |
| Related URLs: | |
| Depositing User: | Ay Okpokam |
| Date Deposited: | 19 Jun 2015 13:18 |
| Last Modified: | 12 Oct 2019 19:06 |
| URI: | http://nrl.northumbria.ac.uk/id/eprint/23015 |
Actions (login required)
 |
View Item |
Downloads
Downloads per month over past year
