Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Wu, Qiang, Lorenz, Norbert, Cannon, Kevin, Wang, Changhai, Moore, A. and Hand, Duncan (2008) Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam. In: 2008 2nd Electronics Systemintegration Technology Conference. IEEE, Piscataway, NJ, pp. 669-678. ISBN 9781424428137

Full text not available from this repository.

Abstract

In this paper we investigate and compare a laser-driven joining process with two different illumination conditions: (i) high speed scanning of a focused beam and (ii) reasonably uniform ldquoflood illuminationrdquo of the whole sample. It is shown that the scanning beam not only avoids illuminating the central part of the device, but also provides more uniform heating of the area to be bonded than laser ldquoflood illuminationrdquo. We demonstrate bonding of three different packages: (i) LCC (Leadless chip carrier) packages, (ii) AlN and (iii) LTCC (Low temperature co-fired ceramic) substrates to ldquotop-hatrdquo packages, using a scanned beam from a fibre-delivered high power laser diode array to cure an intermediate layer of glass frit. Standard leak testing demonstrates that all those samples have excellent hermetic sealing with leak rates at the level of 10-9 atmldrcc/s.

Item Type:	Book Section
Subjects:	H600 Electronic and Electrical Engineering
Depositing User:	Ay Okpokam
Date Deposited:	19 Jun 2015 13:29
Last Modified:	12 Oct 2019 22:29
URI:	http://nrl.northumbria.ac.uk/id/eprint/23016

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