Surface micromachined membranes for wafer level packaging

Gallant, Andrew and Wood, David (2005) Surface micromachined membranes for wafer level packaging. Journal of Micromechanics and Microengineering, 15 (7). S47-S52. ISSN 0960-1317

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Novel surface micromachined membranes have been developed for wafer level packaging and polymer encapsulation. Laterally unconstrained electroforming allows small etch holes to be included in thick membranes whilst only requiring a thin, low stress, mould. These holes have been shown to have a sufficiently small aperture (<10 µm) and depth (17 µm) to block a high viscosity encapsulant (AZ4562 photoresist). However, they enable the low viscosity sacrificial release etchant (acetone) to pass through. Etch hole inclusion provides a rapid and clean release. In order to route interconnect to the membranes, side port flow channels have been developed which effectively block spin-on encapsulants from entering the protected cavity. The influence of the membranes on the RF performance of micromachined meander inductors is reported.

Item Type: Article
Subjects: F200 Materials Science
Department: Faculties > Engineering and Environment > Geography and Environmental Sciences
Depositing User: Becky Skoyles
Date Deposited: 29 Mar 2018 12:15
Last Modified: 11 Oct 2019 21:18

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