Three-Dimensional Simulation Platform for Optimal Designs of the MEMS Microphone

Cai, Jianbing, Zhou, Jian, Ji, Zhangbin, Tan, Kaitao, Liu, Yi and Fu, Yong Qing (2022) Three-Dimensional Simulation Platform for Optimal Designs of the MEMS Microphone. Frontiers in Materials, 9. p. 959480. ISSN 2296-8016

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MEMS microphone has a wide range of application prospects in electronic devices such as mobile phones, headphones, and hearing aids due to its small size, low cost, and reliable performance. Research and development of MEMS microphones involves multiple thermo-electro-mechanical couplings among various physical and electrical fields. Unfortunately, there is not an accurate three-dimensional (3D) MEMS microphone simulation platform, which can be applied for the design of chip parameters and packaging characteristics. Herein, based on commercial COMSOL software, we have established a 3D simulation platform for MEMS microphones, which is used to systematically study the influences of geometric structure and physics parameters on the sensitivity and frequency responses of the microphone and consider the influences of packaging characteristics on the performance of the microphone. The simulation results are consistent with those obtained using a lumped element method, which proves the accuracy of the simulation platform. The platform can be used to design and explore new principles or mechanisms of MEMS microphone devices.

Item Type: Article
Additional Information: Funding information: This work was supported by the NSFC (No.52075162), The Innovation Leading Program of New and High-tech Industry of Hunan Province (2020GK2015 and 2021GK4014), The Joint Fund Project of the Ministry of Education, The Excellent Youth Fund of Hunan Province (2021JJ20018), the Huxiang Youth Talent Project (2019RS2062), the Key Research & Development Program of Guangdong Province (2020B0101040002), the Natural Science Foundation of Changsha (kq2007026), the Engineering Physics and Science Research Council of the United Kingdom (EPSRC EP/P018998/1), and International Exchange Grant (IEC/NSFC/201078) through Royal Society and the NSFC.
Uncontrolled Keywords: Materials, MEMS, microphone, 3D simulation, frequency responses, sensitivity
Subjects: F200 Materials Science
F300 Physics
Department: Faculties > Engineering and Environment > Mathematics, Physics and Electrical Engineering
Depositing User: Rachel Branson
Date Deposited: 08 Aug 2022 15:01
Last Modified: 08 Aug 2022 15:15

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