Items where Author is "Bunting, Andrew"

Li, Yifan, Fu, Yong Qing, Winters, D., Flynn, Brian, Parkes, William, Brodie, Douglas, Liu, Yufei, Terry, Jonathan, Haworth, Les, Bunting, Andrew, Stevenson, J., Smith, Stewart, Mackay, Logan, Langridge-Smith, Pat, Stokes, Adam and Walton, Anthony (2012) Test Structures for Characterizing the Integration of EWOD and SAW Technologies for Microfluidics. Semiconductor Manufacturing, IEEE Transactions on, 25 (3). pp. 323-330. ISSN 0894-6507

Walton, Anthony, Stevenson, Tom, Underwood, Ian, Terry, Jonathan, Smith, S., Parkes, William, Dunare, Camelia, Lin, H., Li, Yifan, Henderson, Robert, Renshaw, David, Rae, Bruce, Muir, K., Desmulliez, Marc, Flynn, David, MacIntosh, Mike, Holland, Wayne, Murray, Alan, Tang, Tong Boon and Bunting, Andrew (2010) Silicon+-post processing CMOS wafers to create integrated sensors, MEMS and electro-optic systems. SAIEE Research Journal, 10 (1). pp. 3-10. ISSN 1991-1696

Walton, Anthony, Stevenson, Tom, Underwood, Ian, Terry, Jonathan, Smith, S., Parkes, William, Dunare, Camelia, Lin, H., Li, Yifan, Henderson, Robert, Renshaw, David, Muir, K., Desmulliez, Marc, Flynn, David, MacIntosh, Mike, Holland, Wayne, Murray, Alan, Tang, Tong Boon, Bunting, Andrew and Gundlach, A. M. (2007) Integration of IC technology with MEMS: silicon+ technology for the future. In: IET Seminar on Micro Electro-Mechanical Systems, 25 April 2007, London.