Items where Author is "Sujan, D."
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Pok, Y.W., Sujan, D., Rahman, Muhammad and Dol, S.S. (2017) Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging. In: 3rd International Conference on Mechatronics and Mechanical Engineering (ICMME 2016). MATEC Web of Conferences Volume 95 (2017), 95 . EDP Sciences, Paris, 01003. ISBN 9781510836921
Rahman, Muhammad, Muntohar, A.S., Pakrashi, V., Nagaratnam, Brabha and Sujan, D. (2014) Self compacting concrete from uncontrolled burning of rice husk and blended fine aggregate. Materials and Design, 55. pp. 410-415. ISSN 0261-3069
