Deformation analysis of Press-pack IGBT using thermal mechanical coupling method

Gu, Bowen, Wu, Haimeng, Pickert, Volker, Ji, Bing, Dai, Siyang and Wang, Zhiqiang (2022) Deformation analysis of Press-pack IGBT using thermal mechanical coupling method. In: Conference Proceedings of 2021 International Joint Conference on Energy, Electrical and Power Engineering: Power Electronics, Energy Storage and System Control in Energy and Electrical Power Systems. Lecture Notes in Electrical Engineering, 899 . Springer, Singapore, pp. 23-33. ISBN 9789811919213, 9789811919220

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Abstract

Press-pack Insulated Gate Bipolar Transistors (PP IGBT) are becoming increasingly used in HVDC and FACT applications. Due to its unique packaging, its reliability issues have also attracted increasing attention in the engineering field. More comprehensive investigation into the thermal, electrical and mechanical factors should be conducted to reveal the operation condition and status of the devices. The objective of this work is to study the relationship among the deformation of the collector groove and the thermal stress of the chip as well as the contact pressure by simulating the PP IGBT under normal and abnormal conditions. A sophisticated 3D finite element (FE) model of a PP IGBT has been developed which includes the coupling with thermal–mechanical effect. Also, the influence of different pressure and thermal stress on deformation is discussed thoroughly that can provide insight of how to monitor the status of a PP IGBT from the perspective of deformation.

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