Items where Author is "Smith, S."

Zhou, J., Pang, Hua-Feng, Garcia-Gancedo, Luis, Iborra, Enrique, Clement, M., De Miguel-Ramos, M., Jin, H., Luo, Jikui, Smith, S., Dong, S. R., Wang, D. M. and Fu, Yong Qing (2015) Discrete microfluidics based on aluminum nitride surface acoustic wave devices. Microfluidics and Nanofluidics, 18 (4). pp. 537-548. ISSN 1613-4982

Li, Yifan, McHale, Glen, Smith, S., Walton, Anthony and Xu, Ben (2015) Large Surface Strain Sensing Structures based on Elastic Instabilities. In: International Conference on Microelectronic Test Structures (ICMTS), March 23 - 26, 2015, Tempe, Arizona, US.

Li, Yifan, Terry, Jonathan, Smith, S., Walton, Anthony, McHale, Glen and Xu, Ben (2015) Elastic instabilities induced large surface strain sensing structures (EILS). In: Proceedings of the 2015 International Conference on Microelectronic Test Structures. IEEE, Piscataway, NJ, pp. 94-99. ISBN 978-4799-8304-9

Zhang, R., Li, Yifan, Murray, J., Bunting, A., Smith, S., Dunare, C., Stevenson, J., Desmulliez, Marc and Walton, Anthony (2013) Test structures for electrical evaluation of high aspect ratio TSV arrays fabricated using planarised sacrificial photoresist. In: Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on. IEEE, Piscataway, NJ, pp. 37-42. ISBN 978-1-4673-4845-4

Walton, Anthony, Stevenson, Tom, Underwood, Ian, Terry, Jonathan, Smith, S., Parkes, William, Dunare, Camelia, Lin, H., Li, Yifan, Henderson, Robert, Renshaw, David, Rae, Bruce, Muir, K., Desmulliez, Marc, Flynn, David, MacIntosh, Mike, Holland, Wayne, Murray, Alan, Tang, Tong Boon and Bunting, Andrew (2010) Silicon+-post processing CMOS wafers to create integrated sensors, MEMS and electro-optic systems. SAIEE Research Journal, 10 (1). pp. 3-10. ISSN 1991-1696

Walton, Anthony, Stevenson, Tom, Underwood, Ian, Terry, Jonathan, Smith, S., Parkes, William, Dunare, Camelia, Lin, H., Li, Yifan, Henderson, Robert, Renshaw, David, Muir, K., Desmulliez, Marc, Flynn, David, MacIntosh, Mike, Holland, Wayne, Murray, Alan, Tang, Tong Boon, Bunting, Andrew and Gundlach, A. M. (2007) Integration of IC technology with MEMS: silicon+ technology for the future. In: IET Seminar on Micro Electro-Mechanical Systems, 25 April 2007, London.